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For nearly three decades, thousands of companies in numerous industries have turned to DDi for superior solutions. They appreciate our expert engineering, relentless problem solving, superior collaboration, proprietary processes, and state-of-the-art technologies that turn solid ideas into winning products. 
OEMs depend on our competency, experience, and technologies to manufacture cell phones, Wi-Fi nodes, PDAs, and navigation systems, from sonar to wireless LAN. We specialize in products that rely on advanced Signal Integrity to handle ever-increasing bandwidths, RF and Microwave designs and materials for signal speed and High Density Interconnects for increasingly shrinking form factors that are required to perform a much greater number of functions.
[ Back to Top ]  Military and aerospace manufacturers demand long-term reliability and high performance from their designs. We ensure they include plenty of Thermal Management options that allow for thermal dissipation across the circuit as well as offer light weight alternatives to traditional copper cores. To achieve these high performance results, we use exotic materials such as StablCor®; a new laminate system which is a thermally and electrically conductive composite material. DDi is also the leader in providing High Density Interconnect solutions, including MicroVia and Stacked MicroVia. These solutions provide additional PCB routing density by reducing layer count and form factor, while improving electrical performance and reliability.
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Telecom and networking equipment manufacturers rely on densely populated back planes to produce such products as routers, switches and bay stations. These designs, with their increasingly dense circuits and speeds, are challenging traditional Power Distribution techniques. The DDi engineering team has pioneered many techniques to address power delivery, including the ability to process copper up to five ounces; advanced planar buried capacitance materials; and laser and mechanical Via-In-Pad technologies for direct vertical connections without surface traces, providing the lowest possible inductance. Telecom companies also appreciate our expertise in Signal Integrity, RF-Microwave, Thermal Management, and High Density Interconnect.
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DDi is the leading choice for producing DUT (Device Under Test) cards and Probe Cards using HDI designs, particularly laser Via-in-Pad and Stacked Micro Via. These involve direct vertical connections without surface traces, providing the lowest possible inductance. We also offer exceptional fine pitch chipset testing using our advanced reference design builds.
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When long term reliability is paramount and advanced Power Distribution systems are required our customers know they can count on DDi to perform. And with the increasing use of complex micro electronics in automobile components, manufacturers take advantage of our years of experience in High Density Interconnect designs.
[ Back to Top ] Thanks to our breadth of technology solutions and extensive experience with High Density Interconnects, computer manufacturers turn to DDi for outstanding results. They understand the value of reduced layer count and smaller form factors. Additionally, their wireless applications demand our RF / Microwave solutions. Signal Integrity & Signal Speed is becoming increasingly important as the Industry moves to differential signals. Previously we used synchronous clock designs, which were limited to ~600 MHz, future asynchronous clock designs will have no limit on speed as long as signal can be recovered. There is a rapid move toward 2, 5 & 10 Gb/sec and above.Power Distribution is a concern as the power per device continues to increase. CPU’s of today are using more than 100 watts and it is increasing, additionally the number of different voltage levels is increasing adding plane layers and/or multiple split plane.
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DDi Corp. Headquarters 1220 N. Simon Circle, Anaheim, CA 92806 Tel: (714) 688-7200 Fax: (714) 688-7500