PCB’s that incorporate even more advanced chip set solutions, such as 0.4 mm – 0.8 mm BGAs, flip chips, and substrates, require engineered technology solutions. This higher complexity stems from the need for more functionality, speed, drive size — all requiring more specialized materials, higher density, and tighter tolerances. Ideally, DDi will partner with you during the early design phase to ensure that the technology you use will be manufacturable. Keep in mind that engineered projects require intense engineering resources and time, and yields typically are lower because of this attention to detail.

There are several manufacturing elements that have an impact on board cost, delivery time and manufacturability. To learn more about our Key Technology Manufacturing Factors, click here.