There are several manufacturing elements that have an impact on board cost, delivery time and manufacturability. We have taken these aspects and rated them as
Standard,
Advanced and
Engineered. Now when you design your PCB you can anticipate potential cost-drivers, process difficulties, yield loss and delivery issues.
For example, designs that have only
standard manufacturing elements require fairly limited front end engineering review, no material receipt lead time delay and can progress through fabrication with relatively little process oversight.
A PCB requiring material defined as
advanced may require special order from the supplier, adding to final delivery time or more intensive process engineering support.
Additionally, if a design requires several
advanced elements the project might get re-categorized as
engineered. Typical processes or attributes that drive a PCB to the
engineered level would include multiple lamination, drill and plating cycles; mixed surface finishes or extremely dense circuit routing.
If an attribute from the
advanced or
engineered category is involved in a
standard PCB, then the entire PCB becomes either
advanced or
engineered. Combining elements from across multiple categories, or having too many
engineered elements can make the PCB non-manufacturable or cost-prohibitive.
| Category |
Attribute |
DDI |
| Material |
FR4 |
Standard |
| Polyimide and BT |
Standard |
| Buried Capacitance layers .001" HK4 Interra Dupont |
Standard |
| Hydrocarbon Ceramics (Rogers 4000) |
Standard |
| Speed Board bond ply |
Advanced |
| Buried Resistors (Ohmega) |
Advanced |
| Buried Capacitance layers BC2000 |
Advanced |
| PTFE Glass Reinforced (Arlon DiClad or CuClad,) |
Engineered |
| Taconics TLX, TLY |
Engineered |
| Hybrid (mixed materials Teflon/Epoxy OR Ceramic/Epoxy) |
Engineered |
| 3M-C-Ply |
Engineered |
| StablCor® |
Engineered |
| Copper Core |
Engineered |
| Arlon 25N, 25FR |
Engineered |
| PTFE Ceramics (Rogers 3000 & 6000) |
Engineered |
| Arlon AR & AD |
Engineered |
| Taconics RF |
Engineered |
| PTFE (Rogers 5000 RT/Duroid) |
Engineered |
| Arlon AD |
Engineered |
| Taconics TLC |
Engineered |
| Print and Etch Copper Foil Weights for Minimum Line and Space |
|
| 1 oz. Foil / .004" or > line and space |
Standard |
| 2 oz. Foil / .0055" or > line and space |
Standard |
| 3 oz. Foil / .0075" or > line and space |
Standard |
| 4 oz. Foil / .0095" or > line and space |
Standard |
| 3/8 oz. Foil / .0025" or > line and space |
Advanced |
| 1/2 oz. Foil / .003" or > line and space |
Advanced |
Print and Etch Cores with Different Copper Foil Weights
on Opposing Sides |
|
| 1/4 or 3/8 oz. Foil with 1/2 oz. or > |
Standard |
| 1/2 oz. Foil with 1 oz. or > |
Standard |
| 1 oz. Foil with 2 oz. or > |
Advanced |
| 2 oz. Foil with 3 oz. or 4 oz. |
Engineered |
| Plated Layers Foil Weights for Minimum Line and Space |
|
| 1/2 oz. Foil / .005" or > line and space |
Standard |
| 1 oz. Foil / .006" or > line and space |
Standard |
| 2 oz. Foil / .009" or > line and space |
Standard |
| 3 oz. Foil / .013" or > line and space |
Standard |
| 4 oz. Foil / .015" or > line and space |
Standard |
| 3/8 oz. Foil / .003" or > line and space |
Advanced |
| Category |
Attribute |
DDI |
| Lamination |
.024" to .250" |
Standard |
| .012" to .024" |
Advanced |
| .250" to .275" |
Advanced |
| Cavities Constructions Based On Lamination |
Engineered |
| 2 to 24 Layers |
Standard |
| > 24 Layers |
Advanced |
| Sequential Sub Laminations |
|
| Laminate 2 subs |
Advanced |
| Laminate 2 subs with additional cores |
Engineered |
| 3 Lamination Cycles |
Engineered |
| Category |
Attribute |
DDI |
| Laser |
Laser Holes >.008" |
Advanced |
| Laser Holes .005" - .008" |
Engineered |
| Laser Holes with aspect ratios up to 0.4:1 |
Standard |
| Laser holes with aspect ratio 1:1 |
Engineered |
| Copper Filled for laser >.006" |
Engineered |
| Carriers for full build stacked micro vias |
Engineered |
| Stacked micro vias 2+2 |
Advanced |
| Stacked micro vias 3+3 |
Engineered |
| Micro vias stacked on a buried filled holes |
Advanced |
| Fabrication |
Cavities Formed by Milling / Laser Combination |
Engineered |
| Category |
Attribute |
DDI |
| Drill |
Plated Control Depth Drill 0.4:1 |
Standard |
| Plated Control Depth Drill 0.5:1 |
Advanced |
| Plated Control Depth Drill 0.75:1 |
Engineered |
| Control Depth Drill with drilled hole to copper >.007" <.008" |
Advanced |
| Precision Drill |
Advanced |
| Hole to Copper .0065" to .008" with 16 or more layers 1 lam cycle |
Advanced |
| Hole to Copper 8 - 10 mils, 12 or more layers 1 lam cycle |
Standard |
| .008" drill |
Advanced |
| .006" drill |
Advanced |
| Category |
Attribute |
DDI |
| Via Fill |
Conductive & Non-Conductive |
Advanced |
| Category |
Attribute |
DDI |
| Plating |
1 Wrap on a Layer |
Advanced |
| 2 Wraps on a Layer |
Engineered |
| Aspect Ratio: <12:1 |
Standard |
| Aspect Ratio:>than 12:1 and less than 15:1 |
Engineered |
| Plating in the holes > .001" |
Standard |
| Plating in the holes > .001" in Selective Holes |
Advanced |
| Plated Holes with +/-.002" |
Advanced |
| Critical Surface Plating thickness |
Advanced |
| Etchback with mixed copper (differences of 1-1/2 oz. or more) |
Advanced |
| Edge Plating |
Advanced |
| Castellation Holes between .010" and .045" |
Advanced |
| Electrolytic Au on Polyamide |
Advanced |
| Impedance on layers with wrap around plating |
Engineered |
| Cavities with Electrolytic Au Plating in the Cavity |
Engineered |
| Electrolytic Au Body with Spacing <.003" >.002" |
Engineered |
| Category |
Attribute |
DDI |
| Finishes |
OSP/Entek |
Standard |
| Immersion Gold (ENIG) |
Standard |
| Immersion Silver |
Standard |
| Carbon Ink |
Standard |
| Mixed Surface finishes (Electrolytic Au/Entek) |
Advanced |
| Mixed Surface finishes (Selective Electrolytic Au/HASL) |
Advanced |
| Mixed Surface finishes (Sel Electrolytic Soft Au/Immersion Au) |
Advanced |
| Electrolytic Au Flash and Build up |
Advanced |
| Selective Au Pre Etch |
Advanced |
| Etch Off Tie Bars |
Advanced |
| Electrolytic Au encapsulation of features |
Advanced |
| Electroless Ni / Au |
Advanced |
| Selective Ni |
Advanced |
| Immersion Tin |
Advanced |
| Immersion White Tin |
Advanced |
| Electrolytic Hard Au Body |
Advanced |
| Mixed Surface finishes (Immersion Au/Entek) |
Engineered |
| Electrolytic Hard Au Body |
|
| .006" trace and space 1 oz. or less |
Advanced |
| Spacing < .005" 1 oz. foil or less |
Engineered |
| Spacing < .004" 1 oz. foil or less |
Engineered |
| Spacing .003" to .004" on foil less than 1 oz. |
Advanced |
| Electrolytic Soft / Wirebondable Au Body |
|
| .006" trace and space 1 oz. or less |
Advanced |
| Spacing < .005" 1 oz. foil or less |
Advanced |
| Spacing < .004" 1 oz. foil or less |
Engineered |
| Spacing .003" to .004" on foil less than 1 oz. |
Engineered |
| Category |
Attribute |
DDI |
| Mask |
SMT Web >.003" for Green, Blue & Clear |
Standard |
| BGA Web >.0025" |
Advanced |
| Black Mask Web >.0055" |
Standard |
| UV Plug |
Standard |
| UV Legend |
Standard |
| Dry Film |
Standard |
| LPI with Laser Defined Features |
Advanced |
| Category |
Attribute |
DDI |
| Fabrication |
Rout Tolerances <+/-.005" |
Engineered |
| "Jump" Scoring |
Advanced |
| Cavities Formed by Milling |
Advanced |
| Milled Edges |
Advanced |
| Category |
Attribute |
DDI |
Special
Requirements |
IPC Class 3 A (Aerospace) |
Advanced |
| 100 % Cross Sectioning |
Advanced |
| No "X" Outs |
Advanced |
| No Repairs Allowed |
Advanced |
| Source Inspection |
Advanced |
| Mil Spec |
Engineered |