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Key Technology Manufacturing Factors
There are several manufacturing elements that have an impact on board cost, delivery time and manufacturability. We have taken these aspects and rated them as Standard, Advanced and Engineered. Now when you design your PCB you can anticipate potential cost-drivers, process difficulties, yield loss and delivery issues.

For example, designs that have only standard manufacturing elements require fairly limited front end engineering review, no material receipt lead time delay and can progress through fabrication with relatively little process oversight.

A PCB requiring material defined as advanced may require special order from the supplier, adding to final delivery time or more intensive process engineering support.

Additionally, if a design requires several advanced elements the project might get re-categorized as engineered. Typical processes or attributes that drive a PCB to the engineered level would include multiple lamination, drill and plating cycles; mixed surface finishes or extremely dense circuit routing.

If an attribute from the advanced or engineered category is involved in a standard PCB, then the entire PCB becomes either advanced or engineered. Combining elements from across multiple categories, or having too many engineered elements can make the PCB non-manufacturable or cost-prohibitive.

Category Attribute DDI
Material FR4 Standard
Polyimide and BT Standard
Buried Capacitance layers .001" HK4 Interra Dupont Standard
Hydrocarbon Ceramics (Rogers 4000) Standard
Speed Board bond ply Advanced
Buried Resistors (Ohmega) Advanced
Buried Capacitance layers BC2000 Advanced
PTFE Glass Reinforced (Arlon DiClad or CuClad,) Engineered
Taconics TLX, TLY Engineered
Hybrid (mixed materials Teflon/Epoxy OR Ceramic/Epoxy) Engineered
3M-C-Ply Engineered
StablCor® Engineered
Copper Core Engineered
Arlon 25N, 25FR Engineered
PTFE Ceramics (Rogers 3000 & 6000) Engineered
Arlon AR & AD Engineered
Taconics RF Engineered
PTFE (Rogers 5000 RT/Duroid) Engineered
Arlon AD Engineered
Taconics TLC Engineered
Print and Etch Copper Foil Weights for Minimum Line and Space  
1 oz.   Foil /  .004"     or >   line and space Standard
2 oz.   Foil /  .0055"   or >   line and space Standard
3 oz.   Foil /  .0075"   or >   line and space Standard
4 oz.   Foil /  .0095"   or >   line and space Standard
3/8 oz. Foil  / .0025"  or >   line and space Advanced
1/2 oz. Foil  / .003"    or >   line and space Advanced
Print and Etch Cores with Different Copper Foil Weights
on Opposing Sides
 
1/4 or 3/8 oz. Foil with 1/2 oz. or > Standard
1/2 oz. Foil with 1 oz. or > Standard
1 oz. Foil with 2 oz. or > Advanced
2 oz. Foil with 3 oz. or 4 oz. Engineered
Plated Layers Foil Weights for Minimum Line and Space  
1/2 oz. Foil  / .005"    or >   line and space Standard
1 oz.   Foil  / .006"     or >   line and space Standard
2 oz.   Foil  / .009"     or >   line and space Standard
3 oz.   Foil  / .013"     or >   line and space Standard
4 oz.   Foil  / .015"     or >   line and space Standard
3/8 oz. Foil  / .003"    or >   line and space Advanced

Category Attribute DDI
Lamination .024" to .250" Standard
.012" to .024" Advanced
.250" to .275" Advanced
Cavities Constructions Based On Lamination Engineered
2 to 24 Layers Standard
> 24 Layers Advanced
Sequential Sub Laminations  
Laminate 2 subs Advanced
Laminate 2 subs with additional cores Engineered
3 Lamination Cycles Engineered

Category Attribute DDI
Laser Laser Holes >.008" Advanced
Laser Holes .005" - .008" Engineered
Laser Holes with aspect ratios up to 0.4:1 Standard
Laser holes with aspect ratio 1:1 Engineered
Copper Filled for laser >.006" Engineered
Carriers for full build stacked micro vias Engineered
Stacked micro vias 2+2 Advanced
Stacked micro vias 3+3 Engineered
Micro vias stacked on a buried filled holes Advanced
Fabrication Cavities Formed by Milling / Laser Combination Engineered

Category Attribute DDI
Drill Plated Control Depth Drill 0.4:1 Standard
Plated Control Depth Drill 0.5:1 Advanced
Plated Control Depth Drill 0.75:1 Engineered
Control Depth Drill with drilled hole to copper >.007" <.008" Advanced
Precision Drill Advanced
Hole to Copper .0065" to .008" with 16 or more layers 1 lam cycle Advanced
Hole to Copper 8 - 10 mils, 12 or more layers 1 lam cycle Standard
.008" drill Advanced
.006" drill Advanced

Category Attribute DDI
Via Fill Conductive & Non-Conductive Advanced

Category Attribute DDI
Plating 1 Wrap on a Layer Advanced
2 Wraps on a Layer Engineered
Aspect Ratio: <12:1 Standard
Aspect Ratio:>than 12:1 and less than 15:1 Engineered
Plating in the holes > .001" Standard
Plating in the holes > .001" in Selective Holes Advanced
Plated Holes with +/-.002" Advanced
Critical Surface Plating thickness Advanced
Etchback with mixed copper (differences of 1-1/2 oz. or more) Advanced
Edge Plating Advanced
Castellation Holes between .010" and .045" Advanced
Electrolytic Au on Polyamide Advanced
Impedance on layers with wrap around plating Engineered
Cavities with Electrolytic Au Plating in the Cavity Engineered
Electrolytic Au Body with Spacing <.003" >.002" Engineered

Category Attribute DDI
Finishes OSP/Entek Standard
Immersion Gold (ENIG) Standard
Immersion Silver Standard
Carbon Ink Standard
Mixed Surface finishes (Electrolytic Au/Entek) Advanced
Mixed Surface finishes (Selective Electrolytic Au/HASL) Advanced
Mixed Surface finishes (Sel Electrolytic Soft Au/Immersion Au) Advanced
Electrolytic Au Flash and Build up Advanced
Selective Au Pre Etch Advanced
Etch Off Tie Bars Advanced
Electrolytic Au encapsulation of features Advanced
Electroless Ni / Au Advanced
Selective Ni Advanced
Immersion Tin Advanced
Immersion White Tin Advanced
Electrolytic Hard Au Body Advanced
Mixed Surface finishes (Immersion Au/Entek) Engineered
Electrolytic Hard Au Body
.006" trace and space 1 oz. or less Advanced
Spacing < .005" 1 oz. foil or less Engineered
Spacing < .004" 1 oz. foil or less Engineered
Spacing .003" to .004" on foil less than 1 oz. Advanced
Electrolytic Soft / Wirebondable Au Body
.006" trace and space 1 oz. or less Advanced
Spacing < .005" 1 oz. foil or less Advanced
Spacing < .004" 1 oz. foil or less Engineered
Spacing .003" to .004" on foil less than 1 oz. Engineered

Category Attribute DDI
Mask SMT Web >.003" for Green, Blue & Clear Standard
BGA Web >.0025" Advanced
Black Mask Web >.0055" Standard
UV Plug Standard
UV Legend Standard
Dry Film Standard
LPI with Laser Defined Features Advanced

Category Attribute DDI
Fabrication Rout Tolerances <+/-.005" Engineered
"Jump" Scoring Advanced
Cavities Formed by Milling Advanced
Milled Edges Advanced

Category Attribute DDI
Special
Requirements
IPC Class 3 A (Aerospace) Advanced
100 % Cross Sectioning Advanced
No "X" Outs Advanced
No Repairs Allowed Advanced
Source Inspection Advanced
Mil Spec Engineered