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Creating a quality product does not have to add cost. In fact, we prove time after time that in the long-run, doing it “right” the first time can actually save time and cost significantly less.

Find out how to get it right the first time.



High Density Interconnects
These days, electronics companies demand smaller, faster, thinner products with enhanced functionality. And DDi’s pioneering Microvia and Stacked MicroVia (SMV®) technologies deliver, making it possible to produce a wide range of products, from handheld electronics like Apple’s iPod Nano, camera phones, navigation systems and computers to medical devices, sonar to wireless LAN and reference designs for fine pitch chip sets.

SMV® Chart
SMV® Value Proposition
Layer
Count
Layer
Reduction
Layer
Reduction
Value
Add
4 – 8 2 20% signal integrity
10 – 14 4 30% fan-out
16 – 20 6 50% trace
density
22 – 26 8 75% TS, FO, SI
2 + N + 2 Typical Efficiencies