Whether your design is a backplane or a high-performance circuit board, increasing circuit densities and speeds are challenging traditional PCB power distribution techniques. Our engineering team has pioneered many techniques to address power delivery, including our ability to process copper up to five ounces; advanced planar buried capacitance materials providing 500 pf to 1500 pf per-square-inch in conjunction with extremely low sheet inductance; and laser and mechanical Via-In-Pad technologies for direct vertical connections without surface traces, providing the lowest possible inductance.

Click here to watch a webinar on Power Distribution.

Advanced PCB Power Delivery Network