Circuit miniaturization and enhanced performance levels are redefining tolerances essential for producing printed components, filters, and couplers, as well as precision terminations. Our engineering team has a long history of addressing these challenges with such solutions as engineering resources that include 2D and 3D full-wave finite element modeling capabilities; an extensive selection of RF dielectric materials, including hybrid construction compatibilities; and Laser Direct Imaging capabilities for enhanced resolution and +/- 0.001” registration.

Click here to watch a webinar on RF & Microwave.