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Pb Free RoHS Compliant Solutions
DDi in conjunction with select OEMs conducted tests on 9 different FR4 materials to determine which were thermally robust enough to survive the higher temperatures of Lead Free Assembly. The tests included Thermal Stability, Peel Strength, Solder Float, Electrical, Interconnect Stress, Highly Accelerated Thermal Shock, and Conductive Anodic Filament Growth.

Our RoHS Compliance Statement can be found here.

Three major groups for Pb Free Assembly

Group PCB Thickness Reflow Peak Time above Reflow
Group A Up to .062” No greater than 245°  C 30 to 60 seconds
Group B Up to .125” No greater than 260°  C 60 to 90 seconds
Group C .187” or greater No greater than 288°  C 90 to 120 seconds

Standard FR-4 Group A

Material Resin System TG Dk GHz Df
Nelco N4000-11 Multifunctional 175° C 4.1 1 GHz 0.020
Isola FR-370 HR Multifunctional 180° C 4.04 2 GHz 0.021
Hitachi MCL-E-679 High Tg FR-4 183° C 4.3 1 GHz 0.021
Nelco N4000-29 Multifunctional 185° C 4.3 1 GHz 0.015

High Performance FR-4 Group A

Material Resin System TG Dk GHz Df
Nelco N4000-13 EP™ * Enhanced Multifunctional 210° C 3.7 1 GHz 0.009
Isola IS620 ** Modified Epoxy 215° C 3.78 1 GHz 0.009
  * Single lamination only
** Manufacturing challenge, Narrow processing window

Standard FR-4 Group B

Material Resin System TG Dk GHz Df
Isola FR-370 HR Multifunctional 180° C 4.04 2 GHz 0.021
Hitachi MCL-E-679 High Tg FR-4 183° C 4.3 1 GHz 0.021
Nelco N4000-29 Multifunctional 185° C 4.3 1 GHz 0.015

  • Surface Finish: OSP, Immersion Gold, Immersion Silver
  • Solder Mask: Taiyo PSR4000BN – Black, Blue, Clear, Red, White, Yellow, Green
  • Legend: Enthone 10 Series (105 white), Enthone 50 Series (black and blue)