Exponential increases in thermal dissipation at the circuit level have prompted us to develop innovative thermal management solutions, such as conductive-cooled PCB’s traditionally fabricated with solid copper cores. DDi’s quest for even higher performance led us to licensing lighter weight materials using a carbon fiber composite, STABLCOR® with thermal conductivities ranging from 10 to >600 w/m*k, making them ideal for military-aerospace applications. This is the only material that accomplishes thermal management at circuit level without adding weight to the PCB. Additionally it delivers valuable properties such as CTE control, increasing stiffness without adding weight. For more information visit www.stablcor.com

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