Many designs look great during the conceptual stage. However, when they get to production, they can be unrealistic, excessively costly, or even impossible. DDi avoids such surprises with our collaborative engineering process.
Next Generation PCB Design Workshop: 02/24/10 - 02/24/10
Challenges & Solutions for today's PCB's and Navigating Fine Pitch BGA Designs
Please join us for a special PCB Design workshop in Salt Lake City. We will be featuring information sessions and discussions conducted by our Senior Field Application Engineer, Mark Orzech, on the following subjects:
- Choosing the right PCB Materials
- Determining Construction and Via Path
- Use of Blind and Buried Vias, Flat-Wrap™ Technology
- Next Generation PCB Structures
- MicroVia, Deep MicroVia, Stacked MicroVia™
- Routing Techniques for Fine Pitch BGA Devices
- 0.5 mm, 0.4 mm, 0.3 mm and 0.25 mm
Many designs look great during the conceptual stage. However, when they get to production, they can be unrealistic, excessively costly, or even impossible. DDi avoids such surprises with our collaborative engineering process.
DDi Corporate Headquarters 1220 Simon Circle, Anaheim, CA 92806 Tel: (714) 688-7200 Fax: (714) 688-7400