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We invest millions each year in research and development and collaborate with leading industry partners so that you can achieve your goals of creating next-generation products faster, easier, and with superior results.
Click here to learn about some of our most recent breakthroughs
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Event Information
Enabling Technology for Next Generation Printed Circuits: 06/24/10 - 06/24/10
Please join us for a special PCB workshop, we will be featuring a seminar and discussions on the following:
Laser Direct Imaging (LDI), Laser Drilling, Optical Drill & Rout
FLAT-WRAP™ Technology (wrap plating solution)
Thermal Management—Copper Core/STABLCOR® Material Solid Copper Via (ThermalVia™)
Deep Blind Vias (DpBV™)
Microvia Technology Standard Microvias, Stacked MicroVias (SMV™) Deep MicroVias (DpMV™), Deep Stacked MicroVias (DpSMV™)
Next Generation Stacked MicroVias (NextGen-SMV™) 3G-SMV™, HDI-Link™, Sub-Link™
Please RSVP to Lisa Keable @ lkeable@ddiglobal.com
We invest millions each year in research and development and collaborate with leading industry partners so that you can achieve your goals of creating next-generation products faster, easier, and with superior results. 
DDi Corporate Headquarters 1220 Simon Circle, Anaheim, CA 92806 Tel: (714) 688-7200 Fax: (714) 688-7400