Advanced Microvia Structures for Next Generation Printed Circuits: 06/24/10 - 06/24/10

ARC Technology Solutions, 165 Ledge Street, Nashua, NH 03060-3061

Time: 12:00 pm - 3:00 pm

Migration of array packages to 0.8m and ultimately down to 0.4mm pitch and below, are testing the limits of conventional printed circuit technologies. The implications are significant to both the design and manufacture of next generation PWB’s, and no single new technology introduction will be able to address all the issues. Instead, an array of inability technologies will be required to work in concert, to address both signal integrity and the ever increasing interconnect densities associated with chip scale packaging. This presentation will explore the challenges of chip scale packaging and present a production viable solution that will address materials, high aspect ratio plating, and advanced imaging, planar via technologies and registration techniques, all required to produce next generation printed circuits.

Please RSVP Lisa Keable @ lkeable@ddiglobal.com