Next Generation PCB Design Workshop
Salt Lake City, Utah  02/24/10 - 02/24/10
Challenges & Solutions for today's PCB's and Navigating Fine Pitch BGA Designs

Please join us for a special PCB Design workshop in Salt Lake City. We will be featuring information sessions and discussions conducted by our Senior Field Application Engineer, Mark Orzech, on the following subjects:

- Choosing the right PCB Materials

- Determining Construction and Via Path   - Use of Blind and Buried Vias, Flat-Wrap™ Technology

- Next Generation PCB Structures    - MicroVia, Deep MicroVia, Stacked MicroVia™

- Routing Techniques for Fine Pitch BGA Devices   - 0.5 mm, 0.4 mm, 0.3 mm and 0.25 mm

- Avoiding Cost Drivers

Seats are Limited, RSVP now for more information:

Mark Rodgers - mrodgers@ddiglobal.com