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Many designs look great during the conceptual stage. However, when they get to production, they can be unrealistic, excessively costly, or even impossible. DDi avoids such surprises with our collaborative engineering process.

Find out more about our Engineering Process.



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Enabling Technology for Next Generation Printed Circuits
Holiday Inn San Diego - Rancho Bernardo, 17065 W. Bernardo Drive, San Diego, CA 92127

3:00 pm - 6:00 pm Reception to follow

  06/24/10 - 06/24/10


Please join us for a special PCB workshop, we will be featuring a seminar and discussions on the following:

Laser Direct Imaging (LDI), Laser Drilling, Optical Drill & Rout

FLAT-WRAP™ Technology (wrap plating solution)

Thermal Management—Copper Core/STABLCOR® Material Solid Copper Via (ThermalVia™)

Deep Blind Vias (DpBV™)

Microvia Technology Standard Microvias, Stacked MicroVias (SMV™) Deep MicroVias (DpMV™), Deep Stacked MicroVias (DpSMV™)

Next Generation Stacked MicroVias (NextGen-SMV™) 3G-SMV™, HDI-Link™, Sub-Link™

Please RSVP to Lisa Keable @ lkeable@ddiglobal.com
Eptech Vancouver/Coquitlam
Red Robinson Show Theatre June 2, 2010  06/02/10 - 06/02/10
SMTA Midwest Expo & Tech Forum
Sheraton Bloomington Hotel, 7800 Normandale Blvd., Bloomington, MN  06/09/10 - 06/09/10
SMTA Ohio Valley Expo - 2010
Doubletree Hotel, 6200 Quarry Lane, Indepdence (Cleveland), OH  07/14/10 - 07/14/10